
Solder Wire
Description
Solder Wire Form Flux-Cored Wire Material Composition 99.3 Percent Tin 0.6 Percent Copper 0.05 Percent Nickel Wire Diameter 1 mm Weight 100 g Melting Temperature (Minimum) 442 Degrees F Melting Temperature (Maximum) 444 Degrees F Flux Type No-Clean Flux Classification ROM1 Solder Series SCN M1 For Joining Metal Application High Soldering Temperature Container Type Spool
Product Specification
Characteristic | Value |
---|---|
Weight (lb.) | 0.31 lb |
Items per Unit of Issue | 1 |
Country of Origin (subject to change) | Japan |