Solder Wire
Description
Solder Wire Form Flux-Cored Wire Material Composition 99.3 Percent Tin 0.7 Percent Copper Wire Diameter 0.8 mm Weight 500 g Melting Temperature (Maximum) 442 Degrees F Flux Type No-Clean Flux Classification ROM1 Solder Series SC M1 For Joining Metal Application High Soldering Temperature Container Type Spool
Product Specification
| Characteristic | Value |
|---|---|
| Weight (lb.) | 1.18 lb |
| Items per Unit of Issue | 1 |
| Country of Origin (subject to change) | Japan |